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Principle of sputtering thin film deposition technology
Release time:
2024-01-09 11:14
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Sputter deposition is a physical vapor deposition technique in which particles are ejected from a solid target by bombarding a target with high-energy particles. It is an electronic process that deposits thin films of metals or other materials onto various surfaces. Most often, sputtering is used to apply thin coatings on silicon wafers, solar panels, and displays.
How sputter deposition works
Sputtering deposition takes place in a vacuum chamber, where inert gases are introduced, most commonly argon ions. Two items are placed in this chamber: the item to be plated, also known as the "substrate", and the material to be applied, also known as the "sputtering target". After the ionization of argon ions, argon ions acquire kinetic energy under the acceleration of the electric field to bombard the target. Only when the argon ion energy reaches the binding energy of the target electrode (about the sublimation heat of the target material), the atomic migration of the target surface can be achieved. When the energy of the bombarding particle exceeds four times the sublimation heat of the target, the atom is pushed out of the lattice position, becomes a gas phase, escapes from the target, and travels towards the plated material. This process is called sputtering. For most metals, the sputtering threshold energy is about 10 to 25 electron volts.
In short, the basic principle of sputtering deposition can be divided into three process steps
1, gasification of electroplating materials: sputtering;
2. Migration of electroplated atoms, molecules or ions: various reactions occur after the collision of atoms, molecules or ions;
3. Electroplated atoms, molecules or ions are deposited on the substrate.
Advantages
of sputter deposition 1, good durability, the film obtained by sputter deposition is sometimes harder and more resistant to corrosion;
2. Wide range of applications, almost all types of inorganic and some organic coating materials can be used for multiple groups of substrates and surfaces using various finishes;
3. Environmental protection, because the sputtering deposition process occurs in a vacuum environment, it is more environmentally friendly than other traditional coating technologies such as electroplating and painting. And the sputtering process does not produce toxic gases such as CO or SO2;
4. Easy to clean, can save the time and cost of cleaning and polishing of general copper (gold) products, and it is enough to clean the sputtered coated film with a soft cloth or glass cleaner;
5. High quality and multiple choices, a wide variety of colors of sputtering film, delicate and smooth surface, rich in metallic luster, never fade. Common colors are golden yellow (TiN), bright silver (CrN), purple (TiAlN) and so on.
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